360-076 |
Digilent |
47 |
Programmable Logic IC Development Tools Trenz TE0802: Zynq UltraScale+ MPSoC Development Board |
360-076 |
Digilent |
47 |
Programmable Logic IC Development Tools Trenz TE0802: Zynq UltraScale+ MPSoC Development Board |
360-10-102-00-001000 |
Mill-Max |
37 |
Board to Board & Mezzanine Connectors Interconnect Header |
360-10-102-00-001101 |
Preci-Dip |
37 |
Headers & Wire Housings |
360-10-103-00-001000 |
Mill-Max |
37 |
Board to Board & Mezzanine Connectors Interconnect Header |
360-10-103-00-001101 |
Preci-Dip |
2,117 |
Headers & Wire Housings |
360-10-104-00-001000 |
Mill-Max |
37 |
Board to Board & Mezzanine Connectors Interconnect Header |
360-10-104-00-001101 |
Preci-Dip |
37 |
Headers & Wire Housings |
360-10-105-00-001000 |
Mill-Max |
37 |
Board to Board & Mezzanine Connectors Interconnect Header |
360-10-105-00-001101 |
Preci-Dip |
37 |
Headers & Wire Housings |
360-10-106-00-001000 |
Mill-Max |
37 |
Board to Board & Mezzanine Connectors Interconnect Header |
360-10-106-00-001101 |
Preci-Dip |
37 |
Headers & Wire Housings |
360-10-107-00-001000 |
Mill-Max |
37 |
Board to Board & Mezzanine Connectors Interconnect Header |
360-10-107-00-001101 |
Preci-Dip |
37 |
Headers & Wire Housings |
360-10-108-00-001000 |
Mill-Max |
37 |
Board to Board & Mezzanine Connectors Interconnect Header |