IBR210 Heatsink

207-ADIO-KIT

iBASE Technology

I/O Modules 8-Ch. AI / 2-Ch. AO / 8-Ch. DI / 8-Ch. DO slave module with Switch / LED / Meter on-board
207-A202F

iBASE Technology

I/O Modules 4-channel Analog Output (AO) slave module with the pluggable terminal block
207-D522-NN/PP

iBASE Technology

I/O Modules 32-Ch. DI and 32-Ch. DO Slave Module with Pluggable Terminal NPN/PNP type
207-D240-PX

iBASE Technology

I/O Modules 32-channel Digital input slave module with pluggable terminal PNP type
207-D240-NX

iBASE Technology

I/O Modules 32-channel Digital input slave module with pluggable terminal NPN type

ATS-HK379-R0

Advanced Thermal Solutions

Heat Sinks Cooler Backing Plate, High Performance, 96mm Length, 96mm Width, 80mm Hole to Hole, 6mm Standoff Height, 70mm Inner Length, 70mm Inner Width, AI Material
VRA-27-101E

Ohmite

Heat Sinks HEATSINK 27mm BLACK ANODIZED
VRA-55-101E

Ohmite

Heat Sinks HEATSINK 55mm BLACK ANODIZED
426C7-1037B

Wakefield-Vette

Heat Sinks Wedgelock, Black Anodized, 0.260x0.250x4.80 Inch
VXA-35-101E

Ohmite

Heat Sinks HEATSINK BLACK ANODIZED

Part	Manufacturer	Stock	Description
IBR210-D308	iBASE Technology	37	Single Board Computers NXP Cortex -A53 i.MX 8M Dual 1.5GHz, 3GB LPDDR4, 8GB MLC eMMC onboard, Dual LVDS, HDMI, RS-232/422/485, USB, M.2 Key-E(2230) and Mini PCI-E w/ SIM socket
IBR210-D308I	iBASE Technology	41	Single Board Computers NXP Cortex -A53 i.MX 8M Dual 1.3GHz, 3GB LPDDR4, 8GB MLC eMMC onboard, Dual LVDS, HDMI, RS-232/422/485, USB, M.2 Key-E(2230) and Mini PCI-E w/ SIM socket
IBR210-Q316	iBASE Technology	37	Single Board Computers NXP Cortex -A53 i.MX 8MQuad 1.5GHz, 3GB LPDDR4, 16GB TLC eMMC onboard, Dual LVDS, HDMI, RS-232/422/485, USB, M.2 Key-E(2230) and Mini PCI-E w/ SIM socket
IBR210-Q316I	iBASE Technology	37	Single Board Computers NXP Cortex -A53 i.MX 8M Quad-I 1.3GHz, 3GB LPDDR4, 16GB TLC eMMC onboard, Dual LVDS, HDMI, RS-232/422/485, USB, M.2 Key-E(2230) and Mini PCI-E w/ SIM socket