EDMHS12M2T2020075KIT
- Mfr.Part #
- EDMHS12M2T2020075KIT
- Manufacturer
- Wandboard
- Package/Case
- -
- Datasheet
- Download
- Description
- Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 0.75 MM THICKNESS FOR NXP I.MX6 DUAL / QUAD / QUADPLUS LIDDED OR I.MX8M
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- Manufacturer :
- Wandboard
- Product Category :
- Heat Sinks
- Designed for :
- EDM i.MX6 Dual/Quad/Quadplus, i.MX8M
- Fin Style :
- Straight Fin
- Mounting Style :
- Screw
- Product :
- Heat Sinks
- Datasheets
- EDMHS12M2T2020075KIT
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WandboardHeat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7
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WandboardHeat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
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WandboardHeat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
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Related products
Part | Manufacturer | Stock | Description |
---|---|---|---|
EDMHS12M2T2020125KIT | TechNexion | 47 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE |
EDMHS12M2T2020150KIT | Wandboard | 117 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.50 MM THICKNESS FOR NXP I.MX6UL / ULL OR I.MX6 DUAL / QUAD / QUADPLUS UNLIDDED OR I.MX7 |
EDMHSCP12200501 | TechNexion | 50 | Heat Sinks EDM COMPACT 12mm PASS HEATSINK |
EDMHSCP12201001 | TechNexion | 37 | Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR |